Спецификации
- ЧипсетIntel® B760 Chipset
- BIOS128 Mb Flash ROM, UEFI AMI BIOS
- Памет4 x DIMM, Max. 128GB, DDR4 5333(OC)/ 5066(OC)/ 5000(OC)/ 4800(OC)/ 4600(OC)/ 4400(OC)/ 4266(OC)/ 4000(OC)/ 3733(OC)/ 3600(OC)/ 3466(OC)/ 3400(OC)/ 3333(OC)/ 3200/ 3000/ 2933/ 2800/ 2666/ 2400/ 2133 Non-ECC, Un-buffered Memory; Dual Channel Memory Architecture; Supports Intel® Extreme Memory Profile (XMP); OptiMem II
- АудиоRealtek 7.1 Surround Sound High Definition Audio CODEC; Supports: Jack-detection, Multi-streaming, Front Panel Jack-retasking; Supports up to 24-Bit/192 kHz playback; Audio Features; Audio Shielding; Premium audio capacitors; Dedicated audio PCB layers
- КонекториFan and Cooling related; 1 x 4-pin CPU Fan header; 1 x 4-pin CPU OPT Fan header; 2 x 4-pin Chassis Fan headers; Power related; 1 x 24-pin Main Power connector; 1 x 8-pin +12V Power connector; Storage related; 2 x M.2 slots (Key M); 4 x SATA 6Gb/s ports; USB; 2 x USB 3.2 Gen 1 headers support 4 additional USB 3.2 Gen 1 ports; 1 x USB 3.2 Gen 1 connector (supports USB Type-C®); 2 x USB 2.0 headers support 4 additional USB 2.0 ports; 1 x USB 2.0 header supports 1 additional USB 2.0 port; Miscellaneous; 3 x Addressable Gen 2 headers; 1 x Aura RGB header; 1 x Clear CMOS header; 1 x COM Port header; 1 x Front Panel Audio header (AAFP); 1 x LPT header; 1 x S/PDIF Out header; 1 x SPI TPM header (14-1pin); 1 x 20-3 pin System Panel header with Chassis intrude function
- СофтуерWindows® 11, Windows® 10 64-bit
- Форм-факторmATX Form Factor 9.6 inch x 9.6 inch ( 24.4 cm x 24.4 cm )
- Гаранция, м.36 Months
