Спецификации

Чипсет
Intel® B860 Chipset
BIOS
256(128+128) Mb Flash ROM, UEFI AMI BIOS
Памет
2 x DIMM slots, max. 128GB, DDR5;Supports up to 8800+MT/s (OC), Non-ECC, Un-buffered ,Clocked Unbuffered DIMM (CUDIMM);Dual channel memory architecture;DIMM Fit;Supports Intel® Extreme Memory Profile (XMP) memory module;ASUS Enhanced Memory Profile III(AEMPIII)
Аудио
Realtek 7.1 Surround Sound High Definition Audio CODEC*;- Supports: Jack-detection, Multi-streaming, Front Panel Jack-retasking;- Supports up to 24-Bit/192 kHz playback;Audio Features;- Audio Shielding;- Premium audio capacitors;- Dedicated audio PCB layers;* A chassis with an HD audio module in the front panel is required to support 7.1 Surround Sound audio output
Конектори
Fan and Cooling Related;1 x 4-pin CPU Fan header;2 x 4-pin Chassis Fan headers;Power Related;1 x 24-pin Main Power connector;1 x 8-pin +12V CPU Power connectorStorage Related;2 x M.2 slots (Key M);4 x SATA 6Gb/s ports;USB;1 x USB 5Gbps connector (supports USB Type-C® );1 x USB 5Gbps header supports 2 additional USB 5Gbps ports;2 x USB 2.0 headers support 4 additional USB 2.0 ports;Miscellaneous;2 x Addressable Gen2 headers;1 x Aura RGB header;1 x Clear CMOS header;1 x COM Port header;1 x Front Panel Audio header (F_AUDIO);1 x S/PDIF Out header1 x SPI TPM header (14-1 pin);1 x 10-1 pin Front Panel System header
Софтуер
Windows 11(22H2 & later), Windows 10 64-bit(21H2 & later)
Форм-фактор
micro-ATX Form Factor;24.4cm x 22.2cm
Гаранция, м.
36 Months