Спецификации
- ЧипсетAMD X870 Chipset
- BIOS256 Mb Flash ROM, UEFI AMI BIOS
- Памет4 x DIMM slots, max. 256GB, DDR5;Supports up to 8000+MT/s(OC) with Ryzen™ 9000 & 8000 & 7000 Series Processors;ECC and Non-ECC, Un-buffered DIMM;Dual channel memory architecture;Supports;AMD Extended Profiles for Overclocking (EXPO™);ASUS Enhanced Memory Profile (AEMP)
- АудиоRealtek ALC1220P 7.1 Surround Sound High Definition Audio CODEC;- Impedance sense for front and rear headphone outputs;- Internal audio Amplifier to enhance the highest quality sound for headphone and speakers;- Supports: Jack-detection, Multi-streaming, Front Panel Jack-retasking;- High quality 120 dB SNR stereo playback output and 113 dB SNR recording input (Line-in);- Supports up to 32-Bit/192 kHz playback;Audio Features;- Audio Shielding;- Premium audio capacitors;- Dedicated audio PCB layers;- Audio cover;- Unique de-pop circuit
- КонекториFan and Cooling Related;1 x 4-pin CPU Fan header;1 x 4-pin CPU OPT Fan header;1 x 4-pin AIO Pump header;4 x 4-pin Chassis Fan headers;1 x W_PUMP+ header;Power Related;1 x 24-pin Main Power connector;2 x 8-pin +12V CPU Power connectors;Storage Related;4 x M.2 slots (Key M);2 x SATA 6Gb/s ports;USB;1 x USB 20Gbps connector (supports USB Type-C® with up to 30W PD Fast-charge);1 x USB 5Gbps header supports 2 additional USB 5Gbps ports;2 x USB 2.0 headers support 4 additional USB 2.0 ports;Miscellaneous;3 x Addressable Gen 2 headers;1 x Clear CMOS header;1 x Chassis Intrusion header;1 x COM Port header;1 x Front Panel Audio header (F_AUDIO);1 x 10-1 pin Front System Panel header;1 x Thermal Sensor header
- СофтуерWindows 11
- Форм-факторATX Form Factor, 30.5 cm x 24.4 cm
